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Quality & Reliability

Leadership

TSMC's wafers and foundry services demonstrate our commitment to world-class quality and reliability. We ensure unparalleled excellence and consistency through the definition, development, and execution of reliability testing, data and root analysis, and quality engineering methodologies. Equipped with state-of-the-art failure analysis tools, reliability testing ability and years of semiconductor manufacturing experience, TSMC professionals work with our customers to develop new technologies and continuously enhance the quality and reliability of products.

	The Result:
	Industry-leading technology and annual customer satisfaction surveys affirm that quality and reliability are among TSMC's greatest strengths.

Quality System Overview

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A Culture of Leading Edge Performance and Continuous Improvement

TSMC constantly sets the industry standard for excellence in semiconductor foundry services. This drive is at the heart of our efforts to establish and maintain long-term partnerships with our customers worldwide. To achieve this end, we measure our quality policy on one basic objective: Zero defects.

Accountability

As part of our commitment to complete customer satisfaction, all TSMC employees are required to continuously evaluate and improve the quality of their work. This policy has successfully enabled customers to put full faith and confidence in TSMC's workmanship and advanced processes.

The Result:

	TSMC incorporates quality into every facet of the company's operations.
	TSMC has successfully put into practice an institutionalized culture of continuous improvement.

Quality and Reliability at Every Step

Quality and reliability engineering at TSMC is independent from manufacturing and process engineering. Our objective is to create and maintain the industry's highest quality and reliability performance standards and to develop advanced assembly and related engineering analysis techniques.

TSMC:

	Acts as a customer advocate through activities such as process change control and technical support for customer risk assessment.
	Builds quality and reliability into new technology.
	Constantly develops leading edge quality and reliability methodologies and analysis tools.
	Partners with process engineers to detect and resolve quality and reliability issues by monitoring all production processes.
	Provides failure mechanism and root cause identification for internal and external customers through advanced failure analysis.


Quality and Reliability Milestones:
	April 1993, became the first semiconductor manufacturing company in Taiwan to achieve ISO 9001 certification.
	1995, earned the "Ford Q1 Preferred Quality Award," which is used to recognize superior supplier performance.
	1998, became the first IC manufacturer in Taiwan to obtain the QS-9000 certificate, which requires demanding standards for the health of business management and quality systems.
	2001, obtained the ISO 9001:2000 certificate only five months after the new standards became available, becoming the first Taiwan IC manufacturer to achieve this distinction.
	2002, became the first IC foundry to obtain ISO/TS 16949. The certificate was expanded through the years to cover new Fabs as their capacity became available.
	2006, obtained the IECQ QC 080000 certificate, which demonstrates TSMC as a 'green' supplier on hazardous substance management system.

	The Result:
	TSMC is the foundry industry leader in quality and reliability.

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About Reliability and Failure Analysis

By developing each of its process technologies in accordance with standardized methodologies, TSMC's quality and reliability programs are put into effect prior to any new process technologies becoming available. Each new technology must pass a rigorous qualification procedure based on some of the highest industry standards before it is released for mass production.

Once in production, all processes are constantly monitored against a pre-determined set of standards. The results are published and reviewed monthly.

At the next stage of analysis, cutting-edge failure analysis provides all customers with a full complement of failure site isolation and follow-up physical or chemical analysis techniques. Analysis is augmented by a number of microstructure and tiny-defect analysis capabilities, as well as various material, surface and interface analysis capabilities through ultra-precise cross-section and top-view specimen preparation.

	The Result:
	Quality assurance at every stage of wafer preparation and fabrication.

Reliability and Failure Analysis Missions

	Drive timely new technology qualification through built-in reliability, root cause analysis and partnership with R&D.
	Develop state-of-the-art reliability and failure analysis infrastructures and capabilities to meet today's volume production and tomorrow's challenges.
	Develop online access to reliability systems .
	Maintain reliability equivalency among outsourcing manufacturing fabs.
	Serve as customer advocates through timely consulting and engineering services .

Failure Analysis Capabilities

	Electrical Characterization & Failure Site Localization
	Microstructure & Tiny Defect Analysis
	Material, Surface & Interface Analysis