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晶圓廠區
台積電文教基金會
聯絡我們
高階主管
劉德音
董事長
學歷:
美國加州大學柏克萊分校電機暨電腦資訊博士
經歷:
總經理暨共同執行長、營運資深副總經理、先進技術事業資深副總經理、南廠區副總經理、世大積體電路製造公司總經理
Dr. Mark Liu is currently Chairman at TSMC. Prior to assuming this post, he was President and Co-CEO from November 2013 to June 2018 and Co-Chief Operating Officer from March 2012 to November 2013. Before that, he was Senior Vice President of Operations from 2009 to 2012. From 2006 to 2009, he was a Senior Vice President responsible for the Advanced Technology Business at TSMC. He served in a number of executive positions at TSMC Fabs and the Operations organization from 2000 to 2006, and from 1999 to 2000, he was President of Worldwide Semiconductor Manufacturing Corp.

Prior to joining TSMC, from 1987 to 1993, he was with AT&T Bell Laboratory, Holmdel, NJ, as a research manager for the High Speed Electronics Research Laboratory, working on optical fiber communication systems. From 1983 to 1987, he was a process integration manager of CMOS technology development at Intel Corporation, Santa Clara, CA, developing silicon process technologies for Intel microprocessors.

Mark Liu received B.S. degree in electrical engineering from National Taiwan University. He received M.S. and Ph.D. degrees in electrical engineering and computer science from University of California, Berkeley.
魏哲家
總裁暨副董事長
學歷:
美國耶魯大學電機工程博士
經歷:
總經理暨共同執行長、業務開發資深副總經理、主流技術事業資深副總經理、南廠區營運副總經理、 新加坡特許半導體公司資深副總經理
Dr. C. C. Wei joined TSMC in 1998 and currently serves as Chief Executive Officer and Vice Chairman. Prior to his recent appointment, Dr. Wei was TSMC's President and Co-CEO from November 2013 to June 2018 and Co-Chief Operating Officer from March 2012 to November 2013. From 2009 to 2012, he was TSMC’s Senior Vice President of Business Development. Before that, he was Senior Vice President of Main Stream Technology Business.

Before joining TSMC, he was Senior Vice President of Technology at Chartered Semiconductor and Senior Manager, Logic and SRAM technology development at ST Microelectronics.

C. C. Wei received B.S. degree in electrical engineering from National Chiao Tung University. And later he was awarded his PhD by Yale University.
何麗梅
財務資深副總經理暨財務長兼發言人
學歷:
國立台灣大學商學碩士
經歷:
本公司副總經理暨財務長兼發言人、德皏b導體公司副總經理暨財務長
Lora Ho is the Chief Financial Officer and Spokesperson of Taiwan Semiconductor Manufacturing Company Limited (TSMC).

Joined TSMC in 1999, Ms. Ho served as Corporate Controller from 1999 to 2003, and became the Chief Financial Officer since 2003. Prior to TSMC, Ms. Ho served various positions in Accounting and Finance field in Foreign invested companies.

Ms. Ho was awarded " Outstanding Financial Executive " for the year of 1993 by Financial Executives Institute, The " Best Companies' Best CFO " of Taiwan from 2007-2010 by FinanceAsia , also the Best CFO in Asia in 2011 by Institutional Investor.

Ms. Ho received her MBA degree from National Taiwan University in 2003 and a B.A. degree from National Cheng-chi University in 1978.
羅唯仁
研究發展 / 技術發展資深副總經理
學歷:
美國加州大學柏克萊分校固態物理及表面化學博士
經歷:
本公司營運 / 製造技術副總經理、先進技術事業副總經理、研究發展副總經理、營運組織二副總經理、美商英特爾公司CTM廠長暨先進技術發展協理
Dr. Lo is TSMC's Senior Vice President of Research and Development. Prior to this post, he served as Vice President of the Company's Advanced Technology Business.

Dr. Lo joined TSMC in 2004 as Vice President of Operations II and served as Vice President of Research & Development from 2006 to 2009.

Prior to joining TSMC, Dr. Lo was Director of Technology Development and Plant Manager with Intel Corporation's Technology and Manufacturing Group. From 1997 to 2000, he served a Factory Manager, responsible for running Intel's development factory in Santa Clara, California.

Dr. Lo has also worked at U.S. university, the Motorola Research and Development Lab and the Xerox Microelectronics Center.

Dr. Lo received his B.S. degree in physics from National Taiwan University and his M.S. and Ph.D. degrees in Solid State Physics and Surface Chemistry from University of California, Berkeley.
Rick Cassidy
資深副總經理暨北美子公司執行長
學歷:
美國西點軍校工程學位
經歷:
台積電美國子公司客戶管理副總經理
Mr. Cassidy’s electronics career began at Fairchild Semiconductor, later acquired by National Semiconductor. Over an 18-year span he rose through manufacturing, engineering, quality and reliability, and marketing, culminating with his appointment as Vice President and General Manager of National’s Military & Aerospace Division and Co-Chair of National’s General Manager Council.

He joined TSMC North America in 1997 as Vice President of Account Management; promoted to President, TSMC North America in 2005; elected Corporate Vice President, TSMC, Ltd. in 2008; and elected Senior Vice President, TSMC, Ltd. in 2014. Over nearly two decades at TSMC he has helped lead the company to record growth, while contributing greatly to the success of the fabless semiconductor business model. He currently serves on the Global Semiconductor Alliance (GSA) Board of Directors, an organization dedicated to the advancement of the worldwide semiconductor industry.

Prior to entering the semiconductor industry, Mr. Cassidy served as an officer in the U.S. Army. He holds a Bachelor of Science degree in Engineering from the United States Military Academy at West Point.
秦永沛
營運 / 產品發展資深副總經理
學歷:
國立成功大學電機工程碩士
經歷:
本公司生產組織/ 產品發展副總經理
Mr. Y.P. Chin was promoted to Sr. Vice President in November 2016. Prior to this post, Mr. Chin served as TSMC's Vice President of Operations for Product Development. Prior to this, he was Vice President of Advanced Technology Business in TSMC, sharing responsibility with Senior Vice President Dr. Mark Liu for TSMC's advanced technology and 300mm fab operations.

Mr. Chin joined TSMC when it was founded in 1987 and has made significant contribution to TSMC's product engineering capability throughout his career. He was Director of Fab 1 from 1997 to 1998, and in later positions helped manage yield improvement in all new generations of advanced technology, including 0.13-micron, 90nm, 65nm, and 45nm nodes. Mr. Chin pioneered the development of TSMC's Golden Spice Modeling methodology and Design For Manufacturing program.

Prior to joining TSMC, Mr. Chin worked as an engineer with the Industrial Technology Research Institute's Electronics Research and Service Organization (ERSO-ITRI).

Mr. Chin earned his B.S. and M.S. degrees in Electrical Engineering from National Cheng Kung University.
米玉傑
研究發展 / 技術發展資深副總經理
學歷:
美國洛杉磯加州州立大學電機工程博士
經歷:
本公司研究開發組織 / 技術發展副總經理
Dr. Y.J. Mii was promoted to Sr. Vice President in November 2016. Prior to this post, Dr. Y.J. Mii served as TSMC's Vice President of Research and Development (R&D) since 2011. He joined TSMC in 1994 and has been involved continuously in the development and manufacturing of advanced CMOS technologies in both Fab Operation and R&D. Dr. Mii joined R&D in 2001, managing both 90nm and 40nm technology development. Following that he began supervising 28nm technology development, accelerating it to lead the foundry industry.

Dr. Mii was a research staff member at IBM Research before joining TSMC. He joined TSMC as a deputy manager of Fab 3 engineering, eventually rising to senior director of R&D before being promoted.

He holds a B.S. in electrical engineering from National Taiwan University, as well as an M.S. and Ph.D. in Electrical Engineering from the University of California, Los Angeles (UCLA).
林錦坤
資訊技術及資材暨風險管理資深副總經理
學歷:
國立彰化師範大學工業教育與技術學系學士
經歷:
本公司六吋暨八吋廠及製造技術中心副總經理、六吋及八吋廠總廠長、先進技術事業總廠長、十二廠/六廠資深廠長、七廠/四廠/三廠廠長、300mm專案處長
J.K. Linwas promoted to Sr. Vice President in November 2018. Prior to this post, Mr. Lin served as TSMC's Vice President of Information Technology and Materials Management & Risk Management. Prior to this, Mr. Lin served as Vice President of Mainstream Fabs and Manufacturing Technology Center.

J.K. Lin joined TSMC when it was founded in 1987 and held a number of manufacturing positions including Equipment Engineer, Section Manager, and Department Manager in Fab1 and 2. He was responsible for the construction of Fab 3 was later Fab Director of Fab 3, Fab 4, Fab7 and Senior Director for Fab 6, Fab 12, 300mm Fabs, Mainstream Fabs.Prior to joining TSMC, Mr. Lin worked in the Electronic Research & Service Organization (ERSO) of Taiwan's Industrial Technology Research Institute (ITRI).

J.K. Lin earned his B.S. degree from National Changhua University of Education.
王建光
營運 / 晶圓廠營運資深副總經理
學歷:
國立成功大學化學工程碩士
經歷:
本公司十二吋廠副總經理、十二吋廠總廠長、成熟技術事業總廠長、十四廠資深廠長、三廠 / 四廠廠長
J.K. Wang was promoted to Sr. Vice President in November 2018. Prior to this post, he was the Vice President of 300mm fabs operations.

J.K. Wang has served at TSMC since the company was founded in 1987. During his career with TSMC, he has been involved in many different aspects of the company's operations, including module engineering, process integration, R&D technology development, manufacturing, and fab management. Previously, he had been the Fab Director of Fab 3 / Fab 4, and Senior Director for Fab14, mainstream & 300mm Fabs. Mr. Wang has been deeply involved in building up TSMC's manufacturing technology and systems, particularly the fab automation and manufacturing infrastructure.

J.K. Wang received his B.S. and M.S. degrees in chemical engineering from National Cheng-Kung University in 1981 and 1983 respectively.
蔡能賢
品質暨可靠性副總經理
學歷:
美國麻省理工學院材料工程博士
經歷:
本公司品質暨可靠性處資深處長
Dr. N.S. Tsai, TSMC Vice President of Quality and Reliability, joined the company in 1989. As head of Quality and Reliability since 2004, Dr. Tsai has led the successful customer qualification of 90nm, 80nm, and 65nm technologies.

Over his career at TSMC, Dr. Tsai has a wide variety of positions in R&D, Operations, and Assembly & Testing. He was director of Fab 1 from 1993 to 1995, and served as director of Fab 4 from 1995 to 1997, where he established standard quality systems that made Fab 4 an outstanding manufacturing facility as well as TSMC's R&D development fab for several technology generations.

Dr. Tsai also established TSMC's first 12-inch pilot line and was responsible for evaluating and selecting production tools, developing automated manufacturing systems, and transitioning from eight-inch to 12-inch production. He also developed TSMC's flip chip technology and established TSMC's first 12-inch wafer bumping line when he was the head of Assembly & Test.

Before joining TSMC, Dr. Tsai served with AT&T's R&D department for 5 years.

Dr. Tsai earned his B.S. in Physics from National Tsinghua University, his M.S. degree in Physics from Temple University and his Ph.D. in Materials Science from Massachusetts Institute of Technology.
孫中平
企業規劃組織副總經理
學歷:
美國康乃爾大學材料科學暨工程博士
經歷:
本公司企業規劃組織協理、美商國際商用機器公司(IBM)科技事業群台灣總經理
Dr. Irene Sun is currently TSMC's Vice President Corporate Planning. Prior to this post, she was Senior Director of the Corporate Planning Organization. She joined TSMC in October 2003 as Director of the Corporate Pricing Division.

Prior to TSMC, Dr. Sun worked at IBM for 23 years and held a variety of management positions in R&D, Manufacturing Engineering, Marketing & Sales, and Business Management.

Dr. Sun received her B.S. degree in Nuclear Engineering from National Tsinghua University in Taiwan, and her Ph.D. in Materials Science and Engineering from Cornell University.
侯永清
研究發展 / 技術發展副總經理
學歷:
美國紐約雪城大學電機博士
經歷:
本公司設計暨技術平台組織資深處長、工研院電通所前端設計流程研發
Dr. Cliff Hou was appointed TSMC's Vice President of Research and Development (R&D) in August, 2018. Prior to this post, Dr. Hou served as TSMC’s Vice President at Design and Technology Platform from August, 2011 to July, 2018. He joined TSMC in 1997 and has made profound contribution to TSMC's design technology and ecosystem development.

Over the last decade at TSMC, Dr. Hou helped the company establish TSMC’s Open Innovation Platform® (OIP), which has become one of the most powerful design ecosystems in the global semiconductor industry. From 1997 to 2007, Dr. Hou established the company's technology design kit and reference flow development organizations.

Prior to joining TSMC, Dr. Hou was a section manager specializing in physical verification methodologies at the Computer & Communications Research Laboratories, Industrial Technology Research Institute (ITRI/CCL) in Taiwan; and served as an Associate Professor at Kaohsiung Polytechnic Institute, Taiwan.

Dr. Hou received National Manager Excellence Award in 2010. He led the company's Open Innovation Platform project team to win First National Industry Innovation Award in 2011 by the Ministry of Economic Affairs (MOEA), Taiwan.

Dr. Hou holds 46 U.S. Patents and serves as a member of Board of Directors in Global Unichip Corp. He received his B.S. degree in Control Engineering from Taiwan's National Chiao-Tung University, and his Ph.D. in Electrical and Computer Engineering from Syracuse University.
金平中
策略客戶專案辦公室副總經理
學歷:
美國南加州大學化學博士
經歷:
本公司業務開發副總經理、上海宏力半導體公司研發副總、 美商英特爾技術研發處長
Dr. BJ Woo currently serves as Vice President of Office of Strategic Customer Program at TSMC. Prior to this role, she had served as Vice President of Business Development from November 2013 to August 2018. Dr. Woo joined TSMC as Senior Director of the Advanced Technology Marketing Division in April 2009, where she was responsible for the advanced technology roadmap and technology definition that targeted high performance and low power applications.

Prior to joining TSMC, BJ spent most of her career at Intel Corporation where she held various senior manager positions in the technology development group. She owns 13 patents and was nominated by Intel to enter the Hall of Fame for WITI (women-in-technology-international) in 2006.

BJ received her B.S. degree from National Taiwan University and her PhD from University of Southern California.
方淑華
法務副總經理暨法務長
學歷:
愛荷華大學比較法學碩士
經歷:
本公司副法務長、公司法務處處長、台灣國際專利法律事務所 資深律師
Sylvia Fang was appointed Vice President and General Counsel for TSMC in August, 2014. Previously, she served as Associate General Counsel, heading that organization since February, 2014. Sylvia joined TSMC in 1995. She was previously Director at Corporate Legal Division where she worked on numerous high-profile corporate transactions, precedent-setting intellectual property trade secret litigations, the promotion of significant legal changes and the resolution of corporate governance issues. She also has been working extensively with the Board of Directors, including the independent directors on various Board, Audit Committee and Compensation Committee matters and other special projects.

Prior to her career at TSMC, Sylvia worked at a leading boutique intellectual property law firm (TIPLO) where she developed her expertise on general corporate and IP issues.

The global legal community recognized Sylvia’s achievement in 2005 when the leading publication Asialaw magazine awarded her the “2005 Deep & Far Award for Taiwan In-House Counsel”. She is also known among key government trade, commerce and securities law administrative agencies due to her relations cultivated over the years of promoting important legal changes to support corporate goals.

Sylvia is an attorney admitted in Taiwan having received her LL.B. degree from National Taiwan University, and her M.C.L. from School of Law, University of Iowa.
馬慧凡
人力資源副總經理
學歷:
國立台灣大學國際企業管理碩士
經歷:
本公司人力資源組織長 、趨勢科技人力資源資深副總經理
Connie Ma has been appointed as Vice President of Human Resources since August 2014.  She joined TSMC in June 2014 as Director of Human Resources.

Connie has over 30 years of HR experience.  Prior to joining TSMC, she held several senior HR managerial positions at Trend Micro Inc., NCR Corporation and AT&T Corporation.  Connie was Senior Vice President of Global Human Resources at Trend Micro where she led corporate transformation by building a global HR team to enhance the execution of corporate strategy and culture in terms of realigning organization structure, strengthening global collaboration and facilitating employee engagement.

Connie holds an EMBA from National Taiwan University and a bachelor's degree in business administration from Soochow University.
王英郎
營運 / 晶圓廠營運副總經理
學歷:
國立交通大學電子工程博士
經歷:
南科十四B廠資深廠長
Dr. YL Wang was appointed TSMC's Vice President of Technology Development (TD) in October 2015. Prior to this post, Dr. Wang served as Senior Director of Fab 14B.

Dr. Wang joined TSMC in 1992 and has been deeply involved in building TSMC’s manufacturing technology and methodology. During his 20+ years career, he successfully contributed to mass-production of the company's 0.35-micorn, 0.25-micorn, 0.18-micorn, 0.13-micorn, 90nm, 65nm, 40nm, 20nm and 16nm process technologies, providing significant productivity improvement and defect density enhancement.

Dr. Wang received his B.S. degree in Physics from National Tsing Hua University; his M.S. degree in Materials Science from National Sun Yat-Sen University and Ph.D. in Electrical Engineering and Computer Science from the National Chiao Tung University. He has 109 US patents, and over 100 Republic of China, Peoples Republic of China ,and French patents.
余振華
研究發展 / Integrated Interconnect & Packaging副總經理
學歷:
美國喬治亞理工學院材料工程博士
經歷:
本公司研究開發組織 Integrated Interconnect & Packaging 處資深處長
Dr. Doug Yu was appointed TSMC's Vice President in November 2016. Dr. Yu joined TSMC in 1994. He was previously Senior Director of the Integrated Interconnect & Packaging Division, where he led the development of interconnect technology for integrated circuits.

Dr. Yu received his B.S. degree in Physics and M.S. degree in Materials Science and Engineering both from National Tsing Hua University, and his Ph.D. in Materials Engineering from Georgia Institute of Technology. In 2013, he was elevated to IEEE fellow grade.
Alexander Kalnitsky
台積科技院士、營運 / 特殊技術副總經理
學歷:
加拿大卡爾頓大學電機工程博士
經歷:
本公司研究開發組織特殊技術處資深處長
Dr. Alexander Kalnitsky was appointed TSMC's Vice President in November 2016. Prior to this appointment, Dr. Kalnitsky served as a Senior Director of the More-than-Moore Technologies Division.

Dr. Kalnitsky joined TSMC in 2009. At TSMC, he is a well-respected technical leader with an excellent track record in HV/Power/Analog/RF/CIS/MEMS processes development. He was elected a TSMC Fellow in 2013.

Prior to joining TSMC, Dr. Kalnitsky worked for over 30 years in the semiconductor industry at companies such as Intersil, Maxim Integrated Product, National Semiconductor, STMicroelectronics and Northern Telecom

Dr. Kalnitsky received his M.S. degree in Applied Sciences from the University of Toronto, Canada and Ph.D. in Electrical Engineering from Carleton University, Canada. He authored or co-authored over 140 issued U.S. patents (over 20 invention disclosures filed while at TSMC). Alex has over 120 publications in technical journals and conference presentations.
張曉強
業務開發副總經理
學歷:
美國杜克大學電機工程博士
經歷:
本公司研究發展 / 設計暨技術平台副總經理、美商英特爾公司技術與製造副總經理
Dr. Kevin Zhang currently serves as Vice President of Business Development. Prior to this role, Dr. Zhang served as Vice President of Design and Technology Platform. Before joining TSMC in November 2016, Dr. Zhang was Vice President of Technology and Manufacturing Group and Director of Circuit Technology at Intel, where he was responsible to the development of process design rules, circuit & device modeling, digital libraries, key analog and mixed-signal circuits. He led the development of embedded memory technologies from 90nm to 10nm at Intel. He was also responsible to the design and validation of lead vehicles for process technology development at Intel. Dr. Zhang was elected as Intel Fellow in 2005 and led his teams to win 5 Intel Achievement Awards, the highest technical accomplishments at the company.

Dr. Zhang has published more than 80 papers at international conferences and in technical journals and is the editor of Embedded Memory for Nano-Scale VLSIs, published by Springer in 2009. He holds 55 U.S. patents in the field of integrated circuit technology. Dr. Zhang was the 2016 International Solid-State Circuit Conference (ISSCC) Program chair and serves on IEEE VLSI Executive Committee. He is a Fellow of the Institute of Electrical and Electronics Engineers (IEEE). He received his bachelor's degree from Tsinghua University in Beijing and his Ph.D. from Duke University, both in electrical engineering.
張宗生
台積科技院士、營運 / 產品發展副總經理
學歷:
國立清華大學電機工程博士
經歷:
本公司營運組織十二B廠資深廠長
Dr. T.S. Chang was appointed TSMC’s Vice President in February 2018. Dr. Chang joined TSMC in 1995 and was previously Operations Organization’s Senior Director of Fab12B. Since joining TSMC, Dr. Chang has participated in the development of Fab 1, Fab 4, Fab 8, Fab 12 and Fab 14, having more than 24 years of practical experience in Operations Organization. Dr. Chang is a key person to implement TSMC’s leading edge technology into manufacturing.

Dr. Chang received his B.S. degree in Electrical Engineering; M.S. degree in Electrical Engineering and Ph.D. in Electrical Engineering all from National Tsing Hua University.
吳顯揚
研究發展 / 技術發展 / 3奈米平台研發處副總經理
學歷:
美國威斯康辛大學麥迪遜分校電機工程博士
經歷:
本公司研究開發組織3奈米平台研發處資深處長
Dr. Michael Wu was appointed TSMC’s Vice President in February 2018. Dr. Wu joined TSMC R&D in 1996 and participated in advanced CMOS technology development from 0.13um, 90nm, 65nm, 28nm, 16nm to 7nm node in the past 20+ years. He was previously R&D Organization’s Senior Director of N3 Platform Development Division. Dr. Wu is a key person to the success of 16FF and 7nm technologies. He is responsible for 3nm technology development as well.

Dr. Wu received his B.S. degree in Electrical Engineering from National Cheng Kung University; his M.S. degree in Electrical Engineering and Ph.D. in Electrical Engineering both from University of Wisconsin-Madison. Michael also received an EMBA degree in the Institute of Technology Management from National Tsing Hua University. He is an IEEE Fellow for his leadership in CMOS process integration. He has published 45 papers and holds 55 patents in the field of semiconductor technology.
曹敏
研究發展 / 技術發展 / Pathfinding副總經理
學歷:
美國史丹佛大學物理博士
經歷:
本公司研究開發組織Pathfinding處資深處長
Dr. Min Cao was appointed TSMC’s Vice President in February 2018. Dr. Cao joined TSMC in 2002. He has participated in successful development of multiple generations of advanced CMOS technology including N90, N65, N40, N28, N20 and N10. From 2006-2008, he led the development of N40G, the first TSMC technology node utilizing super density scaling (significantly higher than 2x). In 2009, he led the development of N28HP, the 1st TSMC node utilizing HKMG technology. He led the development of N20 from 2010 to 2013, and N10 from 2014 to 2016. Since 2016, Dr. Cao has served as a Senior Director of Path-finding Division.

Prior to joining TSMC, he worked at Hewlett-Packard Laboratories from 1994-1999, PDF Solutions from 1999-2000, and Pericom Semiconductor from 2000-2002, all in the US.

Dr. Cao holds 36 U.S. patents in the field of integrated circuit technology. He has served on many conference committees including IEDM and VLSI Symposium. Min Cao received his B.S. degree in Electronic Engineering from Fudan University in Shanghai, M.S. degree in Physics from San Francisco State University, and his Ph.D. degree in Physics from Stanford University.
黃漢森
研究發展 / 技術研究副總經理
學歷:
美國理海大學電機工程博士
經歷:
美國史丹佛大學電機工程講座教授、美商IBM公司研發資深經理
Dr. H.-S. Philip Wong currently serves as Vice President of Corporate Research responsible for exploring new technologies for TSMC. Prior to joining TSMC, Dr. Wong is Professor of Electrical Engineering and holds the Willard R. and Inez Kerr Bell Professorship in the School of Engineering at Stanford University. He has 16 years of research and path-finding experience at IBM Research, where many of his early research works have led to product technologies. His research aims at translating discoveries in science into practical technologies and has contributed to advancements in nanoscale science and technology, semiconductor technology, solid-state devices, and electronic imaging. He is the founding Faculty Co-Director of the Stanford SystemX Alliance and Faculty Director of the Stanford Non-Volatile Memory Technology Research Initiative (NMTRI). He has held leadership positions at major multi-university research centers of the National Science Foundation and the Semiconductor Research Corporation.

Dr. Wong received his B.Sc. (Hons.) from the University of Hong Kong, his M.S. degree from Stony Brook University, and his Ph.D. from Lehigh University, all in electrical engineering. He has published over 600 papers at international conferences and technical journals and is the co-author of a book and 11 book chapters. He holds 52 US patents. He is an IEEE Fellow. He received the honorary doctorate degree from Institut Polytechnique de Grenoble, France. Dr. Wong and his students have won best paper awards at premier conferences such as the International Solid-State Circuits Conference (ISSCC) and Symposia on VLSI. He served as General Chair of the International Electron Devices Meeting (IEDM) and is currently the Chair of the IEEE Executive Committee of the Symposia on VLSI Technology and Circuits.
廖德堆
營運 / 產品發展 / 先進封裝技術暨服務副總經理
學歷:
美國德州大學阿靈頓分校材料科學博士
經歷:
本公司後段技術暨服務處資深處長、新加坡特許半導體公司副總經理、應用材料公司技術經理
Dr. Marvin Liao was appointed TSMC’s Vice President in November 2018. Dr. Liao joined TSMC in 2002 and is currently Vice President of the Backend Technology and Service Division. He is responsible for the management of backend business and operations, including bumping, InFO, CoWoS, Circuit testing, and turnkey services. During his career with TSMC, Dr. Liao was Technical Director of Fab 6 and Senior Director of Backend Technology.

Dr. Liao received his B.S. degree from National Tsing Hua University, his M.S. and Ph.D. degrees from the University of Texas-Arlington, in Materials Science. Prior to joining TSMC, Dr. Liao worked for over 12 years in the semiconductor industry at companies such as Chartered Semiconductor, Applied Materials and SGS Thomson Microelectronics.

子公司高階主管
 
Rick Cassidy
資深副總經理暨北美子公司執行長
學歷:
美國西點軍校工程學位
經歷:
台積電美國子公司客戶管理副總經理
 
David Keller
北美子公司總經理
學歷:
美國聖湯瑪斯大學商學碩士
經歷:
台積電美國子公司執行副總經理
 
Maria Marced
歐洲子公司總經理
學歷:
西班牙馬德里理工大學電信工程博士
經歷:
飛利浦半導體/恩智浦半導體資深副總裁暨行銷業務總經理
 
小野寺誠
日本子公司總經理
學歷:
美國Willamette University企業管理碩士
經歷:
台積電日本子公司副總經理
 
杜隆欽
台積電 (中國) 有限公司總經理
學歷:
美國杜蘭大學商學碩士
經歷:
本公司人力資源副總經理
本公司企業規劃組織協理
 
羅鎮球
台積電南京有限公司總經理
學歷:
北京大學工商管理學碩士
經歷:
台積電(中國)有限公司 副總經理
台積公司2018年11月營收報告(2018/12/10)
   
台積公司舉辦「供應鏈管理論壇」表揚優良供應商(2018/12/06)
   
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