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Turnkey Service |
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| One-stop Turnkey Service |
| Turnkey Service provides a complete
silicon-to-component value chain, delivering a specified volume
of completely tested components to a specific place at a specific
time all on a single purchase order to TSMC. TSMC manages the
entire value chain from silicon wafer processing through package
design support, wafer sort, wafer bumping, packaging assembly,
final test and shipment. |
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| Turnkey Benefits |
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A shorter production cycle
thanks to concurrent silicon and backend engineering support. |
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Accelerated production ramp through
wafer processing aligning backend readiness . |
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Faster delivery from optimized cycle
time control. |
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Simplified business process and logistics
through transparent WIP and engineering data visibility
on TSMC-OnlineSM. |
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| The Turnkey Service Menu |
| Collaborating with the best
backend service providers and coupled with its own engineering
expertise, IT technology and manufacturing capabilities, TSMC
has developed a streamlined value chain from wafer processing
to drop ship delivery. |
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Backend Engineering
Service |
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Test program correlation,
validation, IP development, optimization, statistical
bin control and yield support. |
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Probe card manufacturing and
maintenance. |
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Component simulation, modeling
and characterization. |
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Backend engineering and prototyping. |
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Backend Production Service –
This comprehensive service portfolio covers the gamut
from product qualification to volume production. Through
a flexible combination of in-house capabilities and top-tier
outsourcing partners, TSMC Turnkey Services meet every
needs from complete component production, assembly, test
and drop shipping to specific back end processes such
as bumping, wafer sort, packaging assembly, and final
test. TSMC finished silicon as: |
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Sorted wafers. |
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Bumped wafers. |
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Probed bumped wafers. |
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Packaged components. |
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Packaged and tested components. |
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| Deep Submicron Turnkey Service |
The emergence of low-k dielectric
material at the 0.13-micron process node was a focal point for
TSMC who collaborated with leading assembly subcontractors to
qualify this groundbreaking technology in both wire-bond and
flip-chip packages.
At the 90-nm node, TSMC is pioneering both 12-inch production
and standard low-k dielectrics. To empower our customer's innovations,
the TSMC Turnkey services will continue to empower innovation
by aligning backend readiness with wafer production. |
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